Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
1MIC 3M662XW DLF 3MIL TH 5 IN |
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Manufacturer
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Manufacturer Product Number
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1MIC 3M662XW DLF 3MIL TH 5 IN
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Description
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LAPPING FILM DIAMOND 1U 5"
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Manufacturer Standard Lead Time
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7 Weeks
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Detailed Description
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Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
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Datasheet
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Datasheet |
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EDA/CAD Models
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1MIC 3M662XW DLF 3MIL TH 5 IN Models |
Product Attributes
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Type
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Description
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Product Status
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Active
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Type
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Lapping Film
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Abrasive Material
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Diamond
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Abrasive Grade
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-
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Abrasive Grit
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-
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Micron Size
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1µ
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Color
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Lavender
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Width
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-
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Length
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-
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Diameter
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5.00" (127.00mm)
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Applications
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Fiber Optic Connector Polishing
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In-Stock: 7,948
Can ship immediately
Quantity
All prices are
in USD
Cut Tape (CT) & Digi-Reel®
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