Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
216-6278-00-3303 |
|
|---|---|
|
Manufacturer
|
|
|
Manufacturer Product Number
|
216-6278-00-3303
|
|
Description
|
CONN IC DIP SOCKET ZIF 16POS GLD
|
|
Manufacturer Standard Lead Time
|
7 Weeks
|
|
Detailed Description
|
Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
|
|
Datasheet
|
Datasheet |
|
EDA/CAD Models
|
216-6278-00-3303 Models |
Product Attributes
|
Type
|
Description
|
|
|---|---|---|
|
Product Status
|
Obsolete
|
|
|
Type
|
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
|
|
|
Number of Positions or Pins (Grid)
|
16 (2 x 8)
|
|
|
Pitch - Mating
|
0.100" (2.54mm)
|
|
|
Contact Finish - Mating
|
Gold
|
|
|
Contact Finish Thickness - Mating
|
250.0µin (6.35µm)
|
|
|
Contact Material - Mating
|
Beryllium Copper
|
|
|
Mounting Type
|
Through Hole
|
|
|
Features
|
Closed Frame
|
|
|
Termination
|
Solder
|
|
|
Pitch - Post
|
0.100" (2.54mm)
|
|
|
Contact Finish - Post
|
Gold
|
|
|
Contact Finish Thickness - Post
|
250.0µin (6.35µm)
|
|
|
Contact Material - Post
|
Beryllium Copper
|
|
|
Housing Material
|
Polyether Imide (PEI), Glass Filled
|
|
|
Operating Temperature
|
-55°C ~ 105°C
|
In-Stock: Contact for stock
Can ship immediately
Quantity
For Use With
