Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
3MIC 3M662XW TH DISC 2.75" |
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Manufacturer
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Manufacturer Product Number
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3MIC 3M662XW TH DISC 2.75"
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Description
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LAPPING FILM DIAMOND 3U 2.75"
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Manufacturer Standard Lead Time
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7 Weeks
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Detailed Description
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Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
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Datasheet
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Datasheet |
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EDA/CAD Models
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3MIC 3M662XW TH DISC 2.75" Models |
Product Attributes
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Type
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Description
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Product Status
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Obsolete
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Type
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Lapping Film
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Abrasive Material
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Diamond
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Abrasive Grade
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-
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Abrasive Grit
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-
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Micron Size
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3µ
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Color
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Pink
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Width
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-
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Length
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-
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Diameter
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2.75" (69.85mm)
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Applications
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Fiber Optic Connector Polishing
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In-Stock: Contact for stock
Can ship immediately
Quantity
