Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
30-1508-30 |
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Manufacturer
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Manufacturer Product Number
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30-1508-30
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Description
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CONN IC DIP SOCKET 30POS GOLD
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Manufacturer Standard Lead Time
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7 Weeks
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Detailed Description
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Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
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Datasheet
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Datasheet |
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EDA/CAD Models
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30-1508-30 Models |
Product Attributes
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Type
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Description
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Product Status
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Active
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Type
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DIP, 0.2" (5.08mm) Row Spacing
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Number of Positions or Pins (Grid)
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30 (2 x 15)
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Pitch - Mating
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0.100" (2.54mm)
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Contact Finish - Mating
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Gold
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Contact Finish Thickness - Mating
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10.0µin (0.25µm)
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Contact Material - Mating
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Beryllium Copper
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Mounting Type
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Through Hole
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Features
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Closed Frame
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Termination
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Wire Wrap
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Pitch - Post
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0.100" (2.54mm)
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Contact Finish - Post
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Tin
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Contact Finish Thickness - Post
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200.0µin (5.08µm)
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Contact Material - Post
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Brass
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Housing Material
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Polyamide (PA46), Nylon 4/6
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Operating Temperature
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-55°C ~ 105°C
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In-Stock: Contact for stock
Can ship immediately
Quantity
For Use With
