Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
GP3004SF-0.016-01-0918 |
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Manufacturer
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Manufacturer Product Number
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GP3004SF-0.016-01-0918
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Description
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BERGQUIST GAP PAD TGP 3004SF
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Manufacturer Standard Lead Time
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7 Weeks
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Detailed Description
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Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
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Datasheet
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Datasheet |
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EDA/CAD Models
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GP3004SF-0.016-01-0918 Models |
Product Attributes
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Type
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Description
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Product Status
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Active
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Usage
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Thermally Conductive
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Type
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Gap Filler Pad, Sheet
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Shape
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Rectangular
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Outline
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457.20mm x 228.60mm
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Thickness
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0.0160" (0.406mm)
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Material
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Non-Silicone
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Adhesive
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Tacky - Both Sides
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Backing, Carrier
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Fiberglass
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Color
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Gray
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Thermal Resistivity
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-
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Thermal Conductivity
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3.0W/m-K
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In-Stock: 4
Can ship immediately
Quantity
For Use With
