Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
PA0170 |
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Manufacturer
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Manufacturer Product Number
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PA0170
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Description
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MINI SOIC-8 EXP PAD TO DIP-8 SMT
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Manufacturer Standard Lead Time
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7 Weeks
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Detailed Description
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Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
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Datasheet
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Datasheet |
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EDA/CAD Models
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PA0170 Models |
Product Attributes
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Type
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Description
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Product Status
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Active
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Proto Board Type
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SMD to DIP
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Package Accepted
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MiniSOIC EP
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Number of Positions
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8
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Pitch
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0.026" (0.65mm)
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Board Thickness
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0.062" (1.57mm) 1/16"
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Material
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FR4 Epoxy Glass
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Size / Dimension
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0.700" x 0.400" (17.78mm x 10.16mm)
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In-Stock: 7,948
Can ship immediately
Quantity
All prices are
in USD
Cut Tape (CT) & Digi-Reel®
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For Use With
