PA0206

Manufacturer
Manufacturer Product Number
PA0206
Description
DFN-16-EXP-PAD TO DIP-20 SMT
Manufacturer Standard Lead Time
7 Weeks
Detailed Description
Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
Datasheet
Datasheet
EDA/CAD Models
PA0206 Models
Product Attributes
Type
Description
Product Status
Active
Proto Board Type
SMD to DIP
Package Accepted
DFN
Number of Positions
16
Pitch
0.020" (0.50mm)
Board Thickness
0.062" (1.57mm) 1/16"
Material
FR4 Epoxy Glass
Size / Dimension
0.700" x 1.000" (17.78mm x 25.40mm)
In-Stock: 7,948
Can ship immediately
All prices are in USD
Cut Tape (CT) & Digi-Reel®
Quantity Unit Price Ext Price