Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
BDN18-6CB/A01 |
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Manufacturer
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Manufacturer Product Number
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BDN18-6CB/A01
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Description
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HEATSINK CPU W/ADHESIVE 1.81"SQ
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Manufacturer Standard Lead Time
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7 Weeks
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Detailed Description
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Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
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Datasheet
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Datasheet |
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EDA/CAD Models
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BDN18-6CB/A01 Models |
Product Attributes
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Type
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Description
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Product Status
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Active
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Type
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Top Mount
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Package Cooled
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Assorted (BGA, LGA, CPU, ASIC...)
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Attachment Method
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Thermal Tape, Adhesive (Included)
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Shape
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Square, Pin Fins
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Length
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1.810" (45.97mm)
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Width
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1.810" (45.97mm)
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Diameter
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-
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Fin Height
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0.605" (15.37mm)
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Power Dissipation @ Temperature Rise
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-
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Thermal Resistance @ Forced Air Flow
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2.80°C/W @ 400 LFM
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Thermal Resistance @ Natural
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8.10°C/W
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Material
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Aluminum
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Material Finish
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Black Anodized
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In-Stock: 1,038
Can ship immediately
Quantity
For Use With
