Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
HSB12-272706 |
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Manufacturer
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Manufacturer Product Number
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HSB12-272706
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Description
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HEAT SINK, BGA, 27 X 27 X 6 MM
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Manufacturer Standard Lead Time
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7 Weeks
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Detailed Description
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Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
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Datasheet
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Datasheet |
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EDA/CAD Models
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HSB12-272706 Models |
Product Attributes
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Type
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Description
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Product Status
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Active
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Type
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Top Mount
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Package Cooled
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BGA
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Attachment Method
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Adhesive
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Shape
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Square, Pin Fins
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Length
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1.063" (27.00mm)
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Width
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1.063" (27.00mm)
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Diameter
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-
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Fin Height
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0.236" (6.00mm)
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Power Dissipation @ Temperature Rise
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3.8W @ 75°C
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Thermal Resistance @ Forced Air Flow
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7.80°C/W @ 200 LFM
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Thermal Resistance @ Natural
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19.59°C/W
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Material
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Aluminum Alloy
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Material Finish
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Black Anodized
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In-Stock: 7,948
Can ship immediately
Quantity
All prices are
in USD
Cut Tape (CT) & Digi-Reel®
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For Use With
