Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
HSB16-404018 |
|
|---|---|
|
Manufacturer
|
|
|
Manufacturer Product Number
|
HSB16-404018
|
|
Description
|
HEAT SINK, BGA, 40 X 40 X 18 MM
|
|
Manufacturer Standard Lead Time
|
7 Weeks
|
|
Detailed Description
|
Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
|
|
Datasheet
|
Datasheet |
|
EDA/CAD Models
|
HSB16-404018 Models |
Product Attributes
|
Type
|
Description
|
|
|---|---|---|
|
Product Status
|
Active
|
|
|
Type
|
Top Mount
|
|
|
Package Cooled
|
BGA
|
|
|
Attachment Method
|
Adhesive
|
|
|
Shape
|
Square, Pin Fins
|
|
|
Length
|
1.575" (40.00mm)
|
|
|
Width
|
1.575" (40.00mm)
|
|
|
Diameter
|
-
|
|
|
Fin Height
|
0.709" (18.00mm)
|
|
|
Power Dissipation @ Temperature Rise
|
9.4W @ 75°C
|
|
|
Thermal Resistance @ Forced Air Flow
|
2.60°C/W @ 200 LFM
|
|
|
Thermal Resistance @ Natural
|
7.96°C/W
|
|
|
Material
|
Aluminum Alloy
|
|
|
Material Finish
|
Black Anodized
|
In-Stock: 371
Can ship immediately
Quantity
For Use With
