EMBP01-F171-H3100

Manufacturer
Manufacturer Product Number
EMBP01-F171-H3100
Description
NEXT GENERATION BLE V5.0 ENCAPSU
Manufacturer Standard Lead Time
7 Weeks
Detailed Description
Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
Datasheet
Datasheet
EDA/CAD Models
EMBP01-F171-H3100 Models
Product Attributes
Type
Description
Product Status
Active
RF Family/Standard
Bluetooth
Protocol
Bluetooth v5.0
Modulation
-
Frequency
2.4GHz
Data Rate
-
Power - Output
6dBm
Sensitivity
-
Serial Interfaces
-
Antenna Type
Antenna Not Included
Utilized IC / Part
-
Memory Size
-
Voltage - Supply
2.3V ~ 3.6V
Current - Receiving
-
Current - Transmitting
-
Mounting Type
Chassis Mount
Operating Temperature
-20°C ~ 60°C
Package / Case
Module
In-Stock: 70
Can ship immediately
All prices are in USD
Cut Tape (CT) & Digi-Reel®
Quantity Unit Price Ext Price