Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
BGAH150-075E |
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Manufacturer
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Manufacturer Product Number
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BGAH150-075E
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Description
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BGA HEATSINK W/TAPE
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Manufacturer Standard Lead Time
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7 Weeks
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Detailed Description
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Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
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Datasheet
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Datasheet |
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EDA/CAD Models
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BGAH150-075E Models |
Product Attributes
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Type
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Description
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Product Status
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Active
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Type
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Top Mount
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Package Cooled
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BGA, CPU, GPU
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Attachment Method
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Thermal Tape, Adhesive (Included)
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Shape
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Square, Angled Fins
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Length
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0.591" (15.00mm)
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Width
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0.591" (15.00mm)
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Diameter
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-
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Fin Height
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0.295" (7.50mm)
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Power Dissipation @ Temperature Rise
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-
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Thermal Resistance @ Forced Air Flow
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-
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Thermal Resistance @ Natural
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18.00°C/W
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Material
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Aluminum Alloy
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Material Finish
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Black Anodized
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In-Stock: Contact for stock
Can ship immediately
Quantity
For Use With
