Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
BGAH270-175E |
|
|---|---|
|
Manufacturer
|
|
|
Manufacturer Product Number
|
BGAH270-175E
|
|
Description
|
BGA HEATSINK W/TAPE
|
|
Manufacturer Standard Lead Time
|
7 Weeks
|
|
Detailed Description
|
Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
|
|
Datasheet
|
Datasheet |
|
EDA/CAD Models
|
BGAH270-175E Models |
Product Attributes
|
Type
|
Description
|
|
|---|---|---|
|
Product Status
|
Active
|
|
|
Type
|
Top Mount
|
|
|
Package Cooled
|
BGA, CPU, GPU
|
|
|
Attachment Method
|
Thermal Tape, Adhesive (Included)
|
|
|
Shape
|
Square, Angled Fins
|
|
|
Length
|
1.063" (27.00mm)
|
|
|
Width
|
1.063" (27.00mm)
|
|
|
Diameter
|
-
|
|
|
Fin Height
|
0.689" (17.50mm)
|
|
|
Power Dissipation @ Temperature Rise
|
-
|
|
|
Thermal Resistance @ Forced Air Flow
|
-
|
|
|
Thermal Resistance @ Natural
|
3.50°C/W
|
|
|
Material
|
Aluminum Alloy
|
|
|
Material Finish
|
Black Anodized
|
In-Stock: 52
Can ship immediately
Quantity
For Use With
