XR2A-2801-N

Manufacturer
Manufacturer Product Number
XR2A-2801-N
Description
CONN IC DIP SOCKET 28POS GOLD
Manufacturer Standard Lead Time
7 Weeks
Detailed Description
Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
Datasheet
Datasheet
EDA/CAD Models
XR2A-2801-N Models
Product Attributes
Type
Description
Product Status
Active
Type
DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)
28 (2 x 14)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
30.0µin (0.76µm)
Contact Material - Post
Beryllium Copper
Housing Material
Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature
-55°C ~ 125°C
In-Stock: 7,948
Can ship immediately
All prices are in USD
Cut Tape (CT) & Digi-Reel®
Quantity Unit Price Ext Price