Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
BU280Z-178-HT |
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Manufacturer
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Manufacturer Product Number
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BU280Z-178-HT
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Description
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CONN IC DIP SOCKET 28POS GOLD
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Manufacturer Standard Lead Time
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7 Weeks
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Detailed Description
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Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
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Datasheet
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Datasheet |
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EDA/CAD Models
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BU280Z-178-HT Models |
Product Attributes
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Type
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Description
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Product Status
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Active
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Type
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DIP, 0.6" (15.24mm) Row Spacing
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Number of Positions or Pins (Grid)
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28 (2 x 14)
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Pitch - Mating
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0.100" (2.54mm)
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Contact Finish - Mating
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Gold
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Contact Finish Thickness - Mating
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78.7µin (2.00µm)
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Contact Material - Mating
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Beryllium Copper
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Mounting Type
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Surface Mount
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Features
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Open Frame
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Termination
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Solder
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Pitch - Post
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0.100" (2.54mm)
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Contact Finish - Post
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Copper
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Contact Finish Thickness - Post
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Flash
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Contact Material - Post
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Brass
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Housing Material
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Polybutylene Terephthalate (PBT), Glass Filled
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Operating Temperature
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-55°C ~ 125°C
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In-Stock: 7,948
Can ship immediately
Quantity
All prices are
in USD
Cut Tape (CT) & Digi-Reel®
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For Use With
