Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
TDU02DXTB |
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Manufacturer
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Manufacturer Product Number
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TDU02DXTB
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Description
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TEST SOCKET
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Manufacturer Standard Lead Time
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7 Weeks
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Detailed Description
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Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
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Datasheet
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Datasheet |
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EDA/CAD Models
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TDU02DXTB Models |
Product Attributes
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Type
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Description
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Product Status
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Active
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Type
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Axial
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Number of Positions or Pins (Grid)
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2 (Rectangular)
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Pitch - Mating
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-
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Contact Finish - Mating
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Gold
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Contact Finish Thickness - Mating
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30.0µin (0.76µm)
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Contact Material - Mating
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Beryllium Copper
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Mounting Type
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Through Hole
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Features
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Board Guide
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Termination
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Solder
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Pitch - Post
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0.150" (3.81mm)
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Contact Finish - Post
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Gold
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Contact Finish Thickness - Post
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30.0µin (0.76µm)
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Contact Material - Post
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Beryllium Copper
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Housing Material
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Polyphenylene Sulfide (PPS)
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Operating Temperature
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-65°C ~ 150°C
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In-Stock: Contact for stock
Can ship immediately
Quantity
For Use With
