Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
TSPS1003H1002BUF |
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Manufacturer
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Manufacturer Product Number
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TSPS1003H1002BUF
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Description
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THIN FILM RES THROUGH HOLE SINGL
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Manufacturer Standard Lead Time
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7 Weeks
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Detailed Description
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Infrared Encoder/Decoder IC Data-Logging, Data Exchange 8-SOIC
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Datasheet
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Datasheet |
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EDA/CAD Models
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TSPS1003H1002BUF Models |
Product Attributes
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Type
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Description
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Product Status
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Active
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Circuit Type
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Isolated
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Resistance (Ohms)
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10k
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Tolerance
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±0.1%
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Number of Resistors
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5
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Resistor Matching Ratio
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±0.1%
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Resistor-Ratio-Drift
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±2ppm/°C
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Number of Pins
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10
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Power Per Element
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100mW
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Temperature Coefficient
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±50ppm/°C
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Operating Temperature
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-55°C ~ 125°C
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Applications
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-
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Mounting Type
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Through Hole
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Package / Case
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10-SIP
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Supplier Device Package
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-
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Size / Dimension
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0.983" L x 0.095" W (24.97mm x 2.41mm)
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Height - Seated (Max)
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0.197" (5.00mm)
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In-Stock: 7,948
Can ship immediately
Quantity
All prices are
in USD
Cut Tape (CT) & Digi-Reel®
| Quantity | Unit Price | Ext Price |
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For Use With
