Sockets for ICs, Transistors
Mfr Part #
Quantity Available
Price
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
9423
In Stock
4.97000
Active
SIP
25 (1 x 25)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
-
Press-Fit
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
222-3343-00-0602J
CONN IC DIP SOCKET ZIF 22POS GLD
3M
75
In Stock
25.50000
Active
DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
1001012
116-83-424-41-018101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
6896
In Stock
2.08420
Active
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
110-83-424-41-005101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
3397
In Stock
1.38210
Active
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-324-41-018101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
6267
In Stock
1.42630
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
123-83-324-41-001101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
3833
In Stock
3.49080
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
4732
COVER PWR TRANS .210"ID TO-3
Keystone Electronics
132
In Stock
7.97000
Active
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1106
In Stock
3.24000
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-87-422-41-006101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
3058
In Stock
1.44230
Active
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
9304
In Stock
0.73000
Active
PLCC
32 (2 x 16)
0.050" (1.27mm)
-
-
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
-
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-55°C ~ 105°C
1001012
ICA-308-SGG
CONN IC DIP SOCKET 8POS GOLD
Samtec Inc.
568
In Stock
3.86000
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Brass
Polyester, Glass Filled
-55°C ~ 125°C
1001012
121-83-424-41-001101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
1343
In Stock
2.51300
Active
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-83-422-41-002101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
5177
In Stock
2.46600
Active
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
06-3513-10
CONN IC DIP SOCKET 6POS GOLD
Aries Electronics
5854
In Stock
1.16660
Active
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
1001012
4808-3000-CP
CONN IC DIP SOCKET 8POS TIN
3M
26239
In Stock
0.63000
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
35.4µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35.0µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
1001012
116-83-640-41-003101
CONN IC DIP SOCKET 40POS GOLD
Preci-Dip
9786
In Stock
3.98880
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
115-87-648-41-001101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
6548
In Stock
2.18060
Active
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
2775
In Stock
13.24520
Active
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
110-87-306-41-105161
CONN IC DIP SOCKET 6POS GOLD
Preci-Dip
3777
In Stock
0.33530
Active
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-83-324-41-011101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
8835
In Stock
3.43290
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-83-310-41-008101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
9829
In Stock
1.07530
Active
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
110-83-624-41-001101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
5828
In Stock
1.28690
Active
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
836-AG11D
CONN IC DIP SOCKET 36POS GOLD
TE Connectivity AMP Connectors
40
In Stock
15.77000
Obsolete
DIP, 0.6" (15.24mm) Row Spacing
36 (2 x 18)
0.100" (2.54mm)
Gold
25.0µin (0.63µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
-
-
-
Polyester
-55°C ~ 105°C
1001012
110-87-314-10-001101
CONN IC DIP SOCKET 14POS GOLD
Preci-Dip
4335
In Stock
0.50330
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C

Sockets for ICs, Transistors