Sockets for ICs, Transistors
|
|
Mfr Part #
|
Quantity Available
|
Price
|
Product Status
|
Type
|
Number of Positions or Pins (Grid)
|
Pitch - Mating
|
Contact Finish - Mating
|
Contact Finish Thickness - Mating
|
Contact Material - Mating
|
Mounting Type
|
Features
|
Termination
|
Pitch - Post
|
Contact Finish - Post
|
Contact Finish Thickness - Post
|
Contact Material - Post
|
Housing Material
|
Operating Temperature
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
5747 In Stock |
18.35880 |
Active |
SIP |
64 (1 x 64) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
- |
Press-Fit |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
5240 In Stock |
2.01720 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
3230 In Stock |
0.32180 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
6 (2 x 3) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
2700 In Stock |
1.98310 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
10927 In Stock |
0.35000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Tin |
60.0µin (1.52µm) |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
60.0µin (1.52µm) |
Phosphor Bronze |
Polybutylene Terephthalate (PBT), Glass Filled |
-55°C ~ 110°C |
|
 |
2227 In Stock |
1.71000 |
Active |
PLCC |
28 (4 x 7) |
0.050" (1.27mm) |
Tin |
160.0µin (4.06µm) |
Copper Alloy |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
160.0µin (4.06µm) |
Copper Alloy |
Polybutylene Terephthalate (PBT), Glass Filled |
-40°C ~ 105°C |
|
 |
3981 In Stock |
1.92280 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
1760 In Stock |
13.90430 |
Active |
SIP |
12 (1 x 12) |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
1846 In Stock |
2.29000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
- |
- |
- |
- |
Through Hole |
- |
Wire Wrap |
- |
- |
- |
- |
- |
- |
|
 |
1788 In Stock |
1.45180 |
Active |
Transistor, TO-5 |
10 (Round) |
- |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
- |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
6634 In Stock |
3.33000 |
Obsolete |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
20.0µin (0.51µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
20.0µin (0.51µm) |
Copper |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 105°C |
|
 |
432 In Stock |
5.25000 |
Obsolete |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Gold |
25.0µin (0.63µm) |
Copper Alloy |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
- |
Copper Alloy |
Polyester |
-55°C ~ 105°C |
|
 |
868 In Stock |
1.15000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
3973 In Stock |
4.12340 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
36 (2 x 18) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
143 In Stock |
9.86000 |
Active |
SIP |
64 (1 x 64) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
- |
Press-Fit |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
1538 In Stock |
2.44740 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
8988 In Stock |
1.55860 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Carrier, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
2955 In Stock |
0.44240 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
6 (2 x 3) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
8661 In Stock |
14.02800 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
22 (2 x 11) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
11 In Stock |
4.45000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Beryllium Copper |
Polybutylene Terephthalate (PBT), Glass Filled |
-55°C ~ 125°C |
|
 |
4050 In Stock |
1.50000 |
Active |
SIP |
7 (1 x 7) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
- |
Press-Fit |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
51 In Stock |
5.34000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
113 In Stock |
1.28000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
80.0µin (2.03µm) |
Brass |
Thermoplastic, Polyester, Glass Filled |
-40°C ~ 105°C |
|
 |
100 In Stock |
4.12000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polyester, Glass Filled |
-55°C ~ 125°C |
