Sockets for ICs, Transistors
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Mfr Part #
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Quantity Available
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Price
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Product Status
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Type
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Number of Positions or Pins (Grid)
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Pitch - Mating
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Contact Finish - Mating
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Contact Finish Thickness - Mating
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Contact Material - Mating
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Mounting Type
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Features
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Termination
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Pitch - Post
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Contact Finish - Post
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Contact Finish Thickness - Post
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Contact Material - Post
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Housing Material
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Operating Temperature
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9693 In Stock |
4.77000 |
Active |
SIP |
24 (1 x 24) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
- |
Press-Fit |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
5168 In Stock |
0.98000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Tin |
35.4µin (0.90µm) |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
35.0µin (0.90µm) |
Phosphor Bronze |
Polyester, Glass Filled |
-25°C ~ 85°C |
|
 |
7152 In Stock |
0.58960 |
Active |
PLCC |
28 (2 x 14) |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Phosphor Bronze |
Polybutylene Terephthalate (PBT) |
-55°C ~ 105°C |
|
 |
7286 In Stock |
1.40210 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Carrier, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
3788 In Stock |
2.47640 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
42 (2 x 21) |
0.070" (1.78mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.070" (1.78mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
5026 In Stock |
1.46080 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
1667 In Stock |
25.45200 |
Active |
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS), Glass Filled |
- |
|
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2797 In Stock |
4.66350 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
120 In Stock |
2.84000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
42 (2 x 21) |
0.070" (1.78mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.070" (1.78mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
28 In Stock |
1.88000 |
Obsolete |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
15.0µin (0.38µm) |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
15.0µin (0.38µm) |
Phosphor Bronze |
Thermoplastic |
-55°C ~ 125°C |
|
 |
46 In Stock |
17.18000 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
7274 In Stock |
7.06000 |
Active |
SIP |
37 (1 x 37) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
- |
Press-Fit |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
457 In Stock |
4.14000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
6247 In Stock |
1.32390 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
72 In Stock |
2.99000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Carrier, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
4707 In Stock |
3.77710 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
5354 In Stock |
3.17000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Tin |
100.0µin (2.54µm) |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
69 In Stock |
3.79000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
10.0µin (0.25µm) |
Brass |
Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
6918 In Stock |
1.76350 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
451 In Stock |
30.47000 |
Obsolete |
QFP |
144 (4 x 36) |
0.050" (1.27mm) |
Tin-Lead |
200.0µin (5.08µm) |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.050" (1.27mm) |
Tin-Lead |
200.0µin (5.08µm) |
Phosphor Bronze |
Liquid Crystal Polymer (LCP) |
- |
|
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2738 In Stock |
1.82180 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
8692 In Stock |
11.04380 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
3751 In Stock |
4.24720 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
2889 In Stock |
2.33130 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
