Sockets for ICs, Transistors

Mfr Part #
Quantity Available
Price
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
4485
In Stock
8.66050
Active
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-83-650-41-013101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
9147
In Stock
12.68850
Active
DIP, 0.6" (15.24mm) Row Spacing
50 (2 x 25)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
06-0513-10T
CONN SOCKET SIP 6POS GOLD
Aries Electronics
2137
In Stock
0.91100
Active
SIP
6 (1 x 6)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1001012
110-83-306-41-005101
CONN IC DIP SOCKET 6POS GOLD
Preci-Dip
1999
In Stock
0.32180
Active
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
48
In Stock
20.78000
Active
DIP, 0.6" (15.24mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
712-93-264-41-001000
SOCKET CARRIER DUAL INLINE 64POS
Mill-Max Manufacturing Corp.
6714
In Stock
20.63740
Active
DIP, 0.1" (2.54mm) Row Spacing
64 (2 x 32)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-83-628-41-002101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
1200
In Stock
3.44240
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
DILB8P-223TLF
CONN IC DIP SOCKET 8POS TIN
Amphenol ICC (FCI)
2013
In Stock
0.36000
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
1231
In Stock
1.88000
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
110-83-650-41-005101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
7721
In Stock
3.37600
Active
DIP, 0.6" (15.24mm) Row Spacing
50 (2 x 25)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
10-2810-90
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
1034
In Stock
9.85000
Active
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Phosphor Bronze
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
1001012
110-99-320-41-001000
CONN IC DIP SOCKET 20POS TINLEAD
Mill-Max Manufacturing Corp.
285
In Stock
1.27000
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
299-87-610-10-002101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
2974
In Stock
2.27680
Active
DIP, 0.6" (15.24mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
122-87-420-41-001101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
8760
In Stock
1.52460
Active
DIP, 0.4" (10.16mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-420-41-007101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
1691
In Stock
1.54630
Active
DIP, 0.4" (10.16mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
115-83-648-41-001101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
7029
In Stock
3.30760
Active
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
8452-11B1-RK-TP
CONN SOCKET PLCC 52POS TIN
3M
3827
In Stock
2.40000
Active
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin
160.0µin (4.06µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
160.0µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
1001012
612-87-422-41-001101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
6601
In Stock
1.54240
Active
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Carrier, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
110-87-322-41-001101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
6720
In Stock
0.61340
Active
DIP, 0.3" (7.62mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
117-87-432-41-105101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
2062
In Stock
2.10270
Active
DIP, 0.4" (10.16mm) Row Spacing
32 (2 x 16)
0.070" (1.78mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
10-823-90C
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
429
In Stock
8.92000
Active
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
1001012
XR2A3221N
CONN IC DIP SOCKET 32POS GOLD
Omron Electronics Inc-EMC Div
9693
In Stock
6.19000
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Threaded
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 125°C
1001012
116-87-636-41-018101
CONN IC DIP SOCKET 36POS GOLD
Preci-Dip
9407
In Stock
2.50810
Active
DIP, 0.6" (15.24mm) Row Spacing
36 (2 x 18)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
122-83-632-41-001101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
7873
In Stock
3.56050
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C

Sockets for ICs, Transistors