Sockets for ICs, Transistors
Mfr Part #
Quantity Available
Price
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
924
In Stock
1.59000
Obsolete
SIP
10 (2 x 5)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
20.0µin (0.51µm)
Copper
Thermoplastic, Polyester
-
128
In Stock
2.51000
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
129
In Stock
4.73000
Active
DIP, 0.9" (22.86mm) Row Spacing
64 (2 x 32)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-83-420-41-008101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
5644
In Stock
2.29880
Active
DIP, 0.4" (10.16mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-628-41-002101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
8199
In Stock
2.74280
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
8428-21B1-RK-TR
CONN SOCKET PLCC 28POS TIN
3M
3522
In Stock
2.08000
Active
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin
160.0µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160.0µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
1001012
110-87-320-41-105101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
6067
In Stock
1.04120
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
ICF-632-S-O-TR
CONN IC DIP SOCKET 32POS TIN
Samtec Inc.
273
In Stock
9.97000
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Liquid Crystal Polymer (LCP)
-55°C ~ 125°C
1001012
117-83-664-41-005101
CONN IC DIP SOCKET 64POS GOLD
Preci-Dip
2516
In Stock
4.42360
Active
DIP, 0.6" (15.24mm) Row Spacing
64 (2 x 32)
0.070" (1.78mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-308-41-003101
CONN IC DIP SOCKET 8POS GOLD
Preci-Dip
8850
In Stock
0.50350
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
PLCC-84-AT-SMT
PLCC SOCKET 84P SMT
Adam Tech
490
In Stock
2.01000
Active
PLCC
84 (4 x 21)
0.050" (1.27mm)
Tin
80.0µin (2.03µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
80.0µin (2.03µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
8078
In Stock
6.52850
Active
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
8444
In Stock
4.99000
Active
SIP
17 (1 x 17)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Carrier
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
299-87-306-10-001101
CONN IC DIP SOCKET 6POS GOLD
Preci-Dip
9306
In Stock
0.97370
Active
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
110-83-322-41-005101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
7569
In Stock
1.26720
Active
DIP, 0.3" (7.62mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-83-422-41-004101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
6495
In Stock
3.89310
Active
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-83-328-41-003101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
7029
In Stock
2.38150
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
2201838-1
CONN SOCKET LGA 2011POS GOLD
TE Connectivity AMP Connectors
275
In Stock
25.21000
Last Time Buy
LGA
2011 (47 x 58)
0.040" (1.02mm)
Gold
15.0µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.035" (0.90mm)
Gold
15.0µin (0.38µm)
Copper Alloy
Thermoplastic
-
1001012
540-88-044-17-400-TR
CONN SOCKET PLCC 44POS TIN
Preci-Dip
5042
In Stock
0.96120
Active
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
-
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polyphenylene Sulfide (PPS)
-
1001012
116-87-636-41-004101
CONN IC DIP SOCKET 36POS GOLD
Preci-Dip
7100
In Stock
6.47680
Active
DIP, 0.6" (15.24mm) Row Spacing
36 (2 x 18)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-316-41-008101
CONN IC DIP SOCKET 16POS GOLD
Preci-Dip
9673
In Stock
1.38410
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
ICM-624-1-GT-HT
MACHINE PIN SOCKET, IC, DIP, 24P
Adam Tech
425
In Stock
1.17000
Active
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Beryllium Copper
Polyphenylene Sulfide (PPS)
-40°C ~ 105°C
1001012
200-6319-9UN-1900
CONN SOCKET PGA ZIF 361POS GOLD
3M
39
In Stock
99.54000
Obsolete
PGA, ZIF (ZIP)
361 (19 x 19)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES)
-55°C ~ 150°C
1001012
116-87-322-41-008101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
7723
In Stock
1.83950
Active
DIP, 0.3" (7.62mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C

Sockets for ICs, Transistors