Sockets for ICs, Transistors

Mfr Part #
Quantity Available
Price
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
1001012
8428-21A1-RK-TP
CONN SOCKET PLCC 28POS TIN
3M
4929
In Stock
0.91800
Active
PLCC
28 (4 x 7)
0.050" (1.27mm)
Tin
160.0µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160.0µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
1001012
116-83-652-41-009101
CONN IC DIP SOCKET 52POS GOLD
Preci-Dip
8151
In Stock
6.65560
Active
DIP, 0.6" (15.24mm) Row Spacing
52 (2 x 26)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
7388
In Stock
7.83000
Active
SIP
41 (1 x 41)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
-
Press-Fit
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
4840-6004-CP
CONN IC DIP SOCKET 40POS TIN
3M
57
In Stock
1.18000
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
35.4µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35.0µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
1001012
4-1437508-0
CONN TRANSIST TO-5 8POS GOLD
TE Connectivity AMP Connectors
262
In Stock
11.29000
Obsolete
Transistor, TO-5
8 (Round)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
-
Beryllium Copper
Polytetrafluoroethylene (PTFE)
-55°C ~ 125°C
1001012
116-87-314-41-012101
CONN IC DIP SOCKET 14POS GOLD
Preci-Dip
1814
In Stock
0.96920
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
110-87-642-41-105161
CONN IC DIP SOCKET 42POS GOLD
Preci-Dip
1549
In Stock
2.75320
Active
DIP, 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
2083
In Stock
14.81600
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Press-Fit
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Thermoplastic
-
1001012
115-83-316-41-001101
CONN IC DIP SOCKET 16POS GOLD
Preci-Dip
4473
In Stock
0.90770
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
110-87-308-41-005101
CONN IC DIP SOCKET 8POS GOLD
Preci-Dip
4775
In Stock
0.26690
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
ICO-628-CTT
CONN IC DIP SKT .100"
Samtec Inc.
9150
In Stock
6.28000
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polyester, Glass Filled
-55°C ~ 105°C
1001012
116-87-308-41-001101
CONN IC DIP SOCKET 8POS GOLD
Preci-Dip
8392
In Stock
0.75130
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
56
In Stock
16.07000
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
214-99-628-01-670800
CONN IC DIP SOCKET 28POS TINLEAD
Mill-Max Manufacturing Corp.
76
In Stock
2.99000
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin-Lead
100.0µin (2.54µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
8059-2G1
CONN TRANSIST TO-5 3POS GOLD
TE Connectivity AMP Connectors
80
In Stock
11.04000
Obsolete
Transistor, TO-5
3 (Round)
-
Gold
-
Copper Alloy
Through Hole
-
Solder
-
Gold
-
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 125°C
1001012
121-83-640-41-001101
CONN IC DIP SOCKET 40POS GOLD
Preci-Dip
4295
In Stock
4.32280
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-306-41-012101
CONN IC DIP SOCKET 6POS GOLD
Preci-Dip
5188
In Stock
0.41540
Active
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
117-87-648-41-105101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
2354
In Stock
3.49230
Active
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.070" (1.78mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
299-83-616-10-002101
CONN IC DIP SOCKET 16POS GOLD
Preci-Dip
1720
In Stock
4.37060
Active
DIP, 0.6" (15.24mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-432-41-018101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
4174
In Stock
2.03270
Active
DIP, 0.4" (10.16mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
14-810-90T
CONN IC DIP SOCKET 14POS TIN
Aries Electronics
256
In Stock
8.55000
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Phosphor Bronze
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
4545
In Stock
12.98600
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-87-322-41-006101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
4310
In Stock
1.23020
Active
DIP, 0.3" (7.62mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1056
In Stock
2.62000
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
Flash
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C

Sockets for ICs, Transistors