Sockets for ICs, Transistors

Mfr Part #
Quantity Available
Price
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
1001012
116-83-318-41-003101
CONN IC DIP SOCKET 18POS GOLD
Preci-Dip
1985
In Stock
1.47810
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-83-650-41-009101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
2088
In Stock
6.39920
Active
DIP, 0.6" (15.24mm) Row Spacing
50 (2 x 25)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
110-87-064-01-505101
CONN IC DIP SOCKET 64POS GOLD
Preci-Dip
7998
In Stock
3.01020
Active
-
64 (2 x 32)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
571
In Stock
1.32000
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
110-99-652-41-001000
CONN IC DIP SOCKET 52POS TINLEAD
Mill-Max Manufacturing Corp.
4429
In Stock
13.39270
Active
DIP, 0.6" (15.24mm) Row Spacing
52 (2 x 26)
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
110-87-322-41-105101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
3199
In Stock
1.14520
Active
DIP, 0.3" (7.62mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-610-41-007101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
8681
In Stock
0.88880
Active
DIP, 0.6" (15.24mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
210-99-640-41-001000
CONN IC DIP SOCKET 40POS TINLEAD
Mill-Max Manufacturing Corp.
4354
In Stock
13.54040
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin-Lead
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
ED068PLCZ
CONN SOCKET PLCC 68POS TIN
On Shore Technology Inc.
6148
In Stock
0.97290
Active
PLCC
68 (2 x 34)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 105°C
5206
In Stock
0.29000
Active
SIP
1 (1 x 1)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
-
Press-Fit
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
110-83-322-41-001101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
5920
In Stock
1.14020
Active
DIP, 0.3" (7.62mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
9873
In Stock
13.44000
Active
SIP
52 (1 x 52)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Carrier
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
224-7397-55-1902
CONN SOCKET SOIC 24POS GOLD
3M
3671
In Stock
39.37400
Active
SOIC
24 (2 x 12)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30.0µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
1001012
117-83-432-41-005101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
4099
In Stock
1.82160
Active
DIP, 0.4" (10.16mm) Row Spacing
32 (2 x 16)
0.070" (1.78mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
69
In Stock
1.73000
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8), 4 Loaded
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-83-652-41-004101
CONN IC DIP SOCKET 52POS GOLD
Preci-Dip
4855
In Stock
10.22480
Active
DIP, 0.6" (15.24mm) Row Spacing
52 (2 x 26)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
214-7390-55-1902
CONN SOCKET SOIC 14POS GOLD
3M
2
In Stock
34.27000
Active
SOIC
14 (2 x 7)
-
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Gold
30.0µin (0.76µm)
Beryllium Copper
Polyethersulfone (PES), Glass Filled
-55°C ~ 150°C
1001012
299-83-316-10-001101
CONN IC DIP SOCKET 16POS GOLD
Preci-Dip
6970
In Stock
3.18890
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-210-41-012101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
3460
In Stock
0.93390
Active
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
SA183040
CONN IC DIP SOCKET 18POS GOLD
On Shore Technology Inc.
1498
In Stock
0.96000
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
80.0µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
1001012
210-99-308-41-001000
CONN IC DIP SOCKET 8POS TIN-LEAD
Mill-Max Manufacturing Corp.
8968
In Stock
11.56620
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin-Lead
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
62
In Stock
5.15000
Active
DIP, 0.3" (7.62mm) Row Spacing
12 (2 x 6)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-87-320-41-007101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
4391
In Stock
1.54630
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
110-99-964-41-001000
CONN IC DIP SOCKET 64POS TINLEAD
Mill-Max Manufacturing Corp.
200
In Stock
4.47000
Active
DIP, 0.9" (22.86mm) Row Spacing
64 (2 x 32)
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C

Sockets for ICs, Transistors