Sockets for ICs, Transistors
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Mfr Part #
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Quantity Available
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Price
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Product Status
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Type
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Number of Positions or Pins (Grid)
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Pitch - Mating
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Contact Finish - Mating
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Contact Finish Thickness - Mating
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Contact Material - Mating
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Mounting Type
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Features
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Termination
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Pitch - Post
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Contact Finish - Post
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Contact Finish Thickness - Post
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Contact Material - Post
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Housing Material
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Operating Temperature
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7461 In Stock |
5.87700 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
 |
1041 In Stock |
2.24000 |
Active |
PLCC |
52 (4 x 13) |
0.050" (1.27mm) |
Tin |
160.0µin (4.06µm) |
Copper Alloy |
Surface Mount |
Closed Frame |
Solder |
0.050" (1.27mm) |
Tin |
160.0µin (4.06µm) |
Copper Alloy |
Polybutylene Terephthalate (PBT), Glass Filled |
-40°C ~ 105°C |
|
 |
3176 In Stock |
1.09560 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
276 In Stock |
7.42000 |
Obsolete |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
- |
Copper Alloy |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
- |
Copper Alloy |
Polyester |
-55°C ~ 105°C |
|
 |
100 In Stock |
20.29000 |
Active |
- |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
20.0µin (0.51µm) |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
20.0µin (0.51µm) |
Phosphor Bronze |
Polybutylene Terephthalate (PBT), Glass Filled |
- |
|
 |
3719 In Stock |
3.02470 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
48 (2 x 24) |
0.070" (1.78mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.070" (1.78mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
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9497 In Stock |
14.20300 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
3179 In Stock |
1.59630 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
22 (2 x 11) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Carrier, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
5605 In Stock |
9.15000 |
Active |
SIP |
50 (1 x 50) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
- |
Press-Fit |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
5652 In Stock |
4.32640 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
50 (2 x 25) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
1434 In Stock |
8.93000 |
Active |
DIP, 0.1" (2.54mm) Row Spacing |
30 (2 x 15) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Carrier, Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
1404 In Stock |
1.97000 |
Obsolete |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Gold |
20.0µin (0.51µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
20.0µin (0.51µm) |
Copper |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 105°C |
|
 |
1769 In Stock |
16.33000 |
Active |
Transistor, TO-3 |
3 (Round) |
- |
Tin-Lead |
20.0µin (0.51µm) |
Beryllium Copper |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin-Lead |
20.0µin (0.51µm) |
Beryllium Copper |
Diallyl Phthalate (DAP) |
-55°C ~ 125°C |
|
 |
5979 In Stock |
4.15330 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
48 (2 x 24) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
631 In Stock |
2.23000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
5774 In Stock |
1.61260 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
394 In Stock |
5.96000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
10.0µin (0.25µm) |
Beryllium Copper |
Polyester |
-55°C ~ 125°C |
|
 |
151 In Stock |
6.76000 |
Active |
DIP, 0.9" (22.86mm) Row Spacing |
64 (2 x 32) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
6284 In Stock |
1.34980 |
Active |
DIP, 0.2" (5.08mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
99 In Stock |
1.24000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
2131 In Stock |
15.38040 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
48 (2 x 24) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
106 In Stock |
2.26000 |
Active |
DIP, 0.2" (5.08mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
-55°C ~ 105°C |
|
 |
5690 In Stock |
2.90510 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
819 In Stock |
1.90000 |
Active |
Transistor, TO-5 |
4 (Round) |
- |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
- |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
