Sockets for ICs, Transistors

Mfr Part #
Quantity Available
Price
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
1001012
410-87-214-10-002101
CONN ZIG-ZAG 14POS GOLD
Preci-Dip
3578
In Stock
0.59320
Active
Zig-Zag
14 (2 x 7)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
30
In Stock
9.67000
Active
DIP, 0.75" (19.05mm) Row Spacing
64 (2 x 32)
0.070" (1.78mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
36
In Stock
6.21000
Active
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-83-318-41-004101
CONN IC DIP SOCKET 18POS GOLD
Preci-Dip
7496
In Stock
3.18520
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
232-1287-00-0602J
CONN IC DIP SOCKET ZIF 32POS GLD
3M
48
In Stock
39.22000
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
1001012
121-83-316-41-001101
CONN IC DIP SOCKET 16POS GOLD
Preci-Dip
3847
In Stock
1.51310
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
WMS-2810Z
CONN IC DIP SOCKET 28POS GOLD
On Shore Technology Inc.
1544
In Stock
0.70020
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame, Wash Away
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
-
-40°C ~ 105°C
9798
In Stock
12.36970
Active
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110
In Stock
2.14000
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
5090
In Stock
8.97000
Active
SIP
49 (1 x 49)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
-
Press-Fit
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
7305
In Stock
4.29000
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
2083
In Stock
3.04000
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
240-1280-00-0602J
CONN IC DIP SOCKET ZIF 40POS GLD
3M
1733
In Stock
29.00000
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
24748
In Stock
2.74000
Active
PLCC
52 (4 x 13)
0.100" (2.54mm)
Tin
150.0µin (3.81µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
06-0518-10
CONN SOCKET SIP 6POS GOLD
Aries Electronics
183
In Stock
1.00000
Active
SIP
6 (1 x 6)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
7852
In Stock
6.04680
Active
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.070" (1.78mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
8393
In Stock
4.18000
Active
SIP
21 (1 x 21)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
-
Press-Fit
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-87-310-41-006101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
6151
In Stock
0.55920
Active
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
299-83-622-10-002101
CONN IC DIP SOCKET 22POS GOLD
Preci-Dip
6437
In Stock
6.21010
Active
DIP, 0.6" (15.24mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-318-41-002101
CONN IC DIP SOCKET 18POS GOLD
Preci-Dip
4203
In Stock
1.51110
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
ED20DT
CONN IC DIP SOCKET 20POS TIN
On Shore Technology Inc.
55337
In Stock
0.31000
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
1001012
110-87-650-41-001101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
1758
In Stock
2.24410
Active
DIP, 0.6" (15.24mm) Row Spacing
50 (2 x 25)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-83-304-41-008101
CONN IC DIP SOCKET 4POS GOLD
Preci-Dip
5924
In Stock
0.41510
Active
DIP, 0.3" (7.62mm) Row Spacing
4 (2 x 2)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
10-9513-11
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
6714
In Stock
5.57500
Active
DIP, 0.9" (22.86mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C

Sockets for ICs, Transistors