Sockets for ICs, Transistors

Mfr Part #
Quantity Available
Price
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
1948
In Stock
2.50280
Active
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
110-87-610-41-005101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
5618
In Stock
0.34520
Active
DIP, 0.6" (15.24mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
2-2129710-8
CONN SOCKET LGA 3647POS GOLD
TE Connectivity AMP Connectors
40
In Stock
37.37000
Active
LGA
3647
-
Gold
30.0µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
-
-
-
Copper Alloy
Thermoplastic
-
1001012
116-87-648-41-013101
CONN IC DIP SOCKET 48POS GOLD
Preci-Dip
7949
In Stock
10.34710
Active
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
80
In Stock
4.00000
Active
DIP, ZIF (ZIP)
40 (2 x 20)
-
Gold
-
-
Through Hole
Closed Frame
Solder
-
Gold
-
-
-
-
1001012
116-83-610-41-013101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
7838
In Stock
2.31380
Active
DIP, 0.6" (15.24mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
197
In Stock
3.78000
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
16-810-90C
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
43
In Stock
12.69000
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
1001012
116-83-432-41-011101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
3369
In Stock
4.72470
Active
DIP, 0.4" (10.16mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-420-41-002101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
2239
In Stock
1.73480
Active
DIP, 0.4" (10.16mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
105200-0008
5.50 BY 5.50MM CAMERA SOCKET, 3.
Molex
1800
In Stock
1.09000
Active
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
11922
In Stock
1.62000
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
122-83-420-41-001101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
2650
In Stock
1.89800
Active
DIP, 0.4" (10.16mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-642-41-007101
CONN IC DIP SOCKET 42POS GOLD
Preci-Dip
5092
In Stock
4.35380
Active
DIP, 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
6799
In Stock
5.08150
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.070" (1.78mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-83-308-41-002101
CONN IC DIP SOCKET 8POS GOLD
Preci-Dip
6329
In Stock
0.81000
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
115-87-610-41-001101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
1611
In Stock
0.38750
Active
DIP, 0.6" (15.24mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
7517
In Stock
9.51000
Active
SIP
52 (1 x 52)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
-
Press-Fit
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
08-6810-90
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
7430
In Stock
9.51000
Active
DIP, 0.6" (15.24mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Phosphor Bronze
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
1001012
299-83-618-10-002101
CONN IC DIP SOCKET 18POS GOLD
Preci-Dip
8800
In Stock
5.24500
Active
DIP, 0.6" (15.24mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
6722
In Stock
6.68000
Active
SIP
35 (1 x 35)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
-
Press-Fit
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
4816-3004-CP
CONN IC DIP SOCKET 16POS TIN
3M
17662
In Stock
0.76000
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
35.4µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35.0µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
1001012
116-83-328-41-008101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
8549
In Stock
3.21820
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
210-99-316-41-001000
CONN IC DIP SOCKET 16POS TINLEAD
Mill-Max Manufacturing Corp.
8635
In Stock
12.22420
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin-Lead
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C

Sockets for ICs, Transistors