Sockets for ICs, Transistors

Mfr Part #
Quantity Available
Price
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
1001012
114-87-314-41-117101
CONN IC DIP SOCKET 14POS GOLD
Preci-Dip
8277
In Stock
0.58490
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
24-6554-16
CONN IC DIP SOCKET ZIF 24POS
Aries Electronics
210
In Stock
48.69000
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Nickel Boron
50.0µin (1.27µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Nickel Boron
50.0µin (1.27µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
1001012
122-83-636-41-001101
CONN IC DIP SOCKET 36POS GOLD
Preci-Dip
6033
In Stock
4.12340
Active
DIP, 0.6" (15.24mm) Row Spacing
36 (2 x 18)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
299-83-310-10-001101
CONN IC DIP SOCKET 10POS GOLD
Preci-Dip
7007
In Stock
1.92440
Active
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
118
In Stock
17.48000
Active
Transistor, TO-220 and TO-247
5 (Rectangular)
-
Gold
30.0µin (0.76µm)
Nickel Boron
Through Hole, Right Angle
-
Solder
-
Gold
30.0µin (0.76µm)
Nickel Boron
Polyphenylene Sulfide (PPS)
-65°C ~ 200°C
600
In Stock
1.87000
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
200-6315-9UN-1900
CONN SOCKET PGA ZIF 225POS GOLD
3M
20
In Stock
91.84000
Obsolete
PGA, ZIF (ZIP)
225 (15 x 15)
0.100" (2.54mm)
-
-
-
-
-
-
0.100" (2.54mm)
-
-
-
Polyethersulfone (PES)
-55°C ~ 150°C
1001012
2-1571551-2
CONN IC DIP SOCKET 8POS GOLD
TE Connectivity AMP Connectors
4254
In Stock
2.07000
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
Flash
Nickel
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
3911
In Stock
4.83590
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Carrier, Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
452
In Stock
1.86000
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
591
In Stock
3.31000
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Copper
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 105°C
1001012
110-87-636-41-005101
CONN IC DIP SOCKET 36POS GOLD
Preci-Dip
7548
In Stock
1.24280
Active
DIP, 0.6" (15.24mm) Row Spacing
36 (2 x 18)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
47
In Stock
4.55000
Active
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-83-306-41-011101
CONN IC DIP SOCKET 6POS GOLD
Preci-Dip
7872
In Stock
0.77480
Active
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
8897
In Stock
14.36780
Active
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-87-306-41-008101
CONN IC DIP SOCKET 6POS GOLD
Preci-Dip
4079
In Stock
0.50170
Active
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
115-87-636-41-003101
CONN IC DIP SOCKET 36POS GOLD
Preci-Dip
9850
In Stock
1.53390
Active
DIP, 0.6" (15.24mm) Row Spacing
36 (2 x 18)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
6956
In Stock
21.74630
Active
DIP, 0.9" (22.86mm) Row Spacing
50 (2 x 25)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
10-3513-10T
CONN IC DIP SOCKET 10POS GOLD
Aries Electronics
8406
In Stock
1.66660
Active
DIP, 0.3" (7.62mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
1001012
115-83-636-41-001101
CONN IC DIP SOCKET 36POS GOLD
Preci-Dip
5160
In Stock
2.48060
Active
DIP, 0.6" (15.24mm) Row Spacing
36 (2 x 18)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1179
In Stock
13.63120
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
ICS-628-T
IC SOCKET, DIP, 28P 2.54MM PITCH
Adam Tech
1876
In Stock
0.29000
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
1001012
114-83-328-41-117101
CONN IC DIP SOCKET 28POS GOLD
Preci-Dip
4983
In Stock
1.64550
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
25-0503-30
CONN SOCKET SIP 25POS GOLD
Aries Electronics
201
In Stock
14.39000
Active
SIP
25 (1 x 25)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
-
Wire Wrap
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA), Nylon, Glass Filled
-

Sockets for ICs, Transistors