Sockets for ICs, Transistors
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Mfr Part #
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Quantity Available
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Price
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Product Status
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Type
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Number of Positions or Pins (Grid)
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Pitch - Mating
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Contact Finish - Mating
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Contact Finish Thickness - Mating
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Contact Material - Mating
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Mounting Type
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Features
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Termination
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Pitch - Post
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Contact Finish - Post
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Contact Finish Thickness - Post
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Contact Material - Post
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Housing Material
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Operating Temperature
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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152 In Stock |
5.80000 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
30 (2 x 15) |
0.070" (1.78mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.070" (1.78mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
5303 In Stock |
14.01590 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
22 (2 x 11) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
3249 In Stock |
11.16000 |
Active |
SIP |
61 (1 x 61) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
- |
Press-Fit |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
261 In Stock |
5.32000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
1036 In Stock |
1.97130 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
30 (2 x 15) |
0.070" (1.78mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.070" (1.78mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
1517 In Stock |
2.29000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
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700 In Stock |
2.53000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
498 In Stock |
3.98000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
2327 In Stock |
1.88350 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
7492 In Stock |
12.93000 |
Active |
SIP |
50 (1 x 50) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Carrier |
Solder |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
1 In Stock |
13.14000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
30 (2 x 15) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
3143 In Stock |
0.61000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Tin |
100.0µin (2.54µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
9558 In Stock |
1.67860 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.070" (1.78mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.070" (1.78mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
3341 In Stock |
2.39300 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
52 (2 x 26) |
0.070" (1.78mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.070" (1.78mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
791 In Stock |
1.23000 |
Active |
PLCC |
20 (4 x 5) |
0.050" (1.27mm) |
Tin |
80.0µin (2.03µm) |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
80.0µin (2.03µm) |
Phosphor Bronze |
Polybutylene Terephthalate (PBT), Glass Filled |
-55°C ~ 105°C |
|
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7449 In Stock |
15.95000 |
Active |
DIP, 0.1" (2.54mm) Row Spacing |
56 (2 x 28) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Carrier, Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
8079 In Stock |
13.70240 |
Active |
SIP |
20 (1 x 20) |
0.100" (2.54mm) |
Tin-Lead |
100.0µin (2.54µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
4302 In Stock |
4.11000 |
Active |
SIP |
14 (1 x 14) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Carrier |
Solder |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
1400 In Stock |
1.73220 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Carrier, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
9053 In Stock |
3.44360 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
6515 In Stock |
2.51300 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
4657 In Stock |
0.76260 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
5263 In Stock |
1.64290 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
42 (2 x 21) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
1820 In Stock |
5.99350 |
Active |
DIP, 0.9" (22.86mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
-55°C ~ 105°C |
