Sockets for ICs, Transistors

Mfr Part #
Quantity Available
Price
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
16
In Stock
5.75000
Active
DIP, 0.9" (22.86mm) Row Spacing
50 (2 x 25)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
59
In Stock
3.32000
Obsolete
PLCC
52 (4 x 13)
0.050" (1.27mm)
Tin
100.0µin (2.54µm)
Phosphor Bronze
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
100.0µin (2.54µm)
Phosphor Bronze
Thermoplastic
-
1001012
116-83-308-41-006101
CONN IC DIP SOCKET 8POS GOLD
Preci-Dip
7924
In Stock
0.61980
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
403
In Stock
2.63000
Active
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
122-83-320-41-001101
CONN IC DIP SOCKET 20POS GOLD
Preci-Dip
9240
In Stock
1.89800
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-83-324-41-002101
CONN IC DIP SOCKET 24POS GOLD
Preci-Dip
7110
In Stock
2.68990
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
8997
In Stock
1.82230
Active
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
224-1286-00-0602J
CONN IC DIP SOCKET ZIF 24POS GLD
3M
73
In Stock
29.94000
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
9065
In Stock
15.64390
Active
DIP, 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
3119
In Stock
20.35260
Active
SIP
64 (1 x 64)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
25-0511-10
CONN SOCKET SIP 25POS TIN
Aries Electronics
5934
In Stock
8.12000
Active
SIP
25 (1 x 25)
0.100" (2.54mm)
Tin
50.0µin (1.27µm)
Phosphor Bronze
Through Hole
-
Solder
0.100" (2.54mm)
Tin
50.0µin (1.27µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
1001012
BU320Z
CONN IC DIP SOCKET 32POS
On Shore Technology Inc.
1752
In Stock
1.39000
Active
-
32 (2 x 16)
-
-
-
-
-
-
-
-
-
-
-
-
-
1001012
NTE435P20
IC 20 PIN DUAL INLINE
NTE Electronics, Inc
269
In Stock
0.46000
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
-
-
-
-
Through Hole
-
Solder
0.100" (2.54mm)
-
-
-
-
-
6323
In Stock
10.00000
Active
SIP
37 (1 x 37)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Carrier
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
100
In Stock
15.80000
Active
-
40 (2 x 20)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-
1001012
116-83-318-41-012101
CONN IC DIP SOCKET 18POS GOLD
Preci-Dip
1855
In Stock
1.64350
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
110-83-318-41-605101
CONN IC DIP SOCKET 18POS GOLD
Preci-Dip
9428
In Stock
1.03640
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
29.5µin (0.75µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
508-AG11D-ES
CONN IC DIP SOCKET 8POS GOLD
TE Connectivity AMP Connectors
1
In Stock
2.02000
Obsolete
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
25.0µin (0.63µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
-
Copper Alloy
Polyester
-55°C ~ 105°C
5712
In Stock
15.65900
Active
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1001012
116-87-632-41-009101
CONN IC DIP SOCKET 32POS GOLD
Preci-Dip
8646
In Stock
3.30820
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
1001012
116-87-650-41-011101
CONN IC DIP SOCKET 50POS GOLD
Preci-Dip
8639
In Stock
6.13320
Active
DIP, 0.6" (15.24mm) Row Spacing
50 (2 x 25)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Elevated, Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
2705
In Stock
12.58050
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7), 4 Loaded
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
2518
In Stock
11.96000
Active
DIP, 0.1" (2.54mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Carrier, Closed Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
263
In Stock
2.46000
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C

Sockets for ICs, Transistors