Sockets for ICs, Transistors
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Mfr Part #
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Quantity Available
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Price
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Product Status
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Type
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Number of Positions or Pins (Grid)
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Pitch - Mating
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Contact Finish - Mating
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Contact Finish Thickness - Mating
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Contact Material - Mating
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Mounting Type
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Features
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Termination
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Pitch - Post
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Contact Finish - Post
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Contact Finish Thickness - Post
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Contact Material - Post
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Housing Material
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Operating Temperature
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3083 In Stock |
2.57000 |
Active |
PLCC |
44 (4 x 11) |
0.050" (1.27mm) |
Tin |
100.0µin (2.54µm) |
Copper Alloy |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
100.0µin (2.54µm) |
Copper Alloy |
Polyphenylene Sulfide (PPS) |
-40°C ~ 105°C |
|
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4300 In Stock |
3.30490 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
7815 In Stock |
2.08240 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
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9609 In Stock |
5.47920 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
42 (2 x 21) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
196.9µin (5.00µm) |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
-55°C ~ 125°C |
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 |
3547 In Stock |
5.37540 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
52 (2 x 26) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
1997 In Stock |
1.45180 |
Active |
Transistor, TO-5 |
10 (Round) |
- |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
- |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
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6684 In Stock |
1.75870 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
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3058 In Stock |
0.97900 |
Active |
SIP |
21 (1 x 21) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
196.9µin (5.00µm) |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
-55°C ~ 125°C |
|
 |
2672 In Stock |
0.95000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
4785 In Stock |
81.03000 |
Active |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
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9403 In Stock |
2.24210 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
4869 In Stock |
1.82760 |
Active |
Transistor, TO-100 |
8 (Round) |
- |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
- |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
2769 In Stock |
0.76000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Tin |
35.4µin (0.90µm) |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
35.0µin (0.90µm) |
Phosphor Bronze |
Polyester, Glass Filled |
-25°C ~ 85°C |
|
 |
6744 In Stock |
2.91030 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.070" (1.78mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.070" (1.78mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
431 In Stock |
1.39000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
80.0µin (2.03µm) |
Brass |
Thermoplastic, Polyester, Glass Filled |
-40°C ~ 105°C |
|
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4646 In Stock |
2.18000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
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2042 In Stock |
3.28000 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
22 (2 x 11) |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass |
Polyamide (PA46), Nylon 4/6, Glass Filled |
- |
|
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6299 In Stock |
1.67780 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
6911 In Stock |
0.96000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Tin |
100.0µin (2.54µm) |
Copper Alloy |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
100.0µin (2.54µm) |
Copper Alloy |
Polyamide (PA), Nylon |
-55°C ~ 105°C |
|
 |
6134 In Stock |
1.37210 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Press-Fit |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
4780 In Stock |
13.22050 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
6906 In Stock |
2.30320 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
22 (2 x 11) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
7361 In Stock |
15.63930 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
50 (2 x 25) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
1 In Stock |
316.53000 |
Active |
PLCC, ZIF (ZIP) |
84 (4 x 21) |
0.100" (2.54mm) |
Gold |
12.0µin (0.30µm) |
- |
Surface Mount |
Closed Frame |
- |
- |
- |
- |
- |
- |
- |
