Sockets for ICs, Transistors
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Mfr Part #
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Quantity Available
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Price
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Product Status
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Type
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Number of Positions or Pins (Grid)
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Pitch - Mating
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Contact Finish - Mating
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Contact Finish Thickness - Mating
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Contact Material - Mating
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Mounting Type
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Features
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Termination
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Pitch - Post
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Contact Finish - Post
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Contact Finish Thickness - Post
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Contact Material - Post
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Housing Material
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Operating Temperature
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3512 In Stock |
1.43640 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame, No Center Bar |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
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2185 In Stock |
4.56250 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
7767 In Stock |
13.67000 |
Active |
DIP, 0.1" (2.54mm) Row Spacing |
48 (2 x 24) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Carrier, Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
124 In Stock |
5.45000 |
Active |
DIP, 0.2" (5.08mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Phosphor Bronze |
Polyamide (PA46), Nylon 4/6, Glass Filled |
-55°C ~ 105°C |
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9500 In Stock |
3.69080 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
50 (2 x 25) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
5350 In Stock |
2.02460 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
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9608 In Stock |
3.18000 |
Active |
SIP |
16 (1 x 16) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
- |
Press-Fit |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
121 In Stock |
1.85000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
481 In Stock |
2.60000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Tin-Lead |
100.0µin (2.54µm) |
Beryllium Copper |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
151 In Stock |
3.21000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polyester, Glass Filled |
-55°C ~ 105°C |
|
 |
8001 In Stock |
0.83600 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
20 (2 x 10) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
162 In Stock |
104.96000 |
Active |
PGA, ZIF (ZIP) |
225 (15 x 15) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
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7830 In Stock |
0.23940 |
Active |
SIP |
2 (1 x 2) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Threaded |
- |
Solder |
0.100" (2.54mm) |
Tin |
196.9µin (5.00µm) |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
-55°C ~ 125°C |
|
 |
4925 In Stock |
1.27860 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
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6259 In Stock |
4.11420 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
42 (2 x 21) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
19 In Stock |
4.59000 |
Obsolete |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
25.0µin (0.63µm) |
Copper Alloy |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
- |
Copper Alloy |
Polyester |
-55°C ~ 105°C |
|
 |
2231 In Stock |
1.12350 |
Active |
Zig-Zag, Left Stackable |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
8108 In Stock |
1.23390 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
8 In Stock |
2.85000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
3048 In Stock |
2.40810 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
27 In Stock |
5.25000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Phosphor Bronze |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Phosphor Bronze |
Polyamide (PA46), Nylon 4/6, Glass Filled |
-55°C ~ 105°C |
|
 |
8255 In Stock |
2.94000 |
Active |
SIP |
10 (1 x 10) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Carrier |
Solder |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
379 In Stock |
28.04000 |
Active |
Transistor, TO-3 |
3 (Oval) |
- |
Tin |
200.0µin (5.08µm) |
Beryllium Copper |
Chassis Mount |
Closed Frame |
Solder |
- |
Tin |
200.0µin (5.08µm) |
Beryllium Copper |
Polytetrafluoroethylene (PTFE) |
-55°C ~ 125°C |
|
 |
7481 In Stock |
0.88000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Tin |
60.0µin (1.52µm) |
Phosphor Bronze |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass, Copper |
Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled |
-40°C ~ 105°C |
