Sockets for ICs, Transistors
|
|
Mfr Part #
|
Quantity Available
|
Price
|
Product Status
|
Type
|
Number of Positions or Pins (Grid)
|
Pitch - Mating
|
Contact Finish - Mating
|
Contact Finish Thickness - Mating
|
Contact Material - Mating
|
Mounting Type
|
Features
|
Termination
|
Pitch - Post
|
Contact Finish - Post
|
Contact Finish Thickness - Post
|
Contact Material - Post
|
Housing Material
|
Operating Temperature
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
2035 In Stock |
2.64000 |
Active |
SIP |
9 (1 x 9) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Carrier |
Solder |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
9672 In Stock |
0.83060 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
6102 In Stock |
9.13560 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
36 (2 x 18) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
14 In Stock |
1.74000 |
Obsolete |
DIP, 0.3" (7.62mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Gold |
25.0µin (0.63µm) |
Copper Alloy |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
25.0µin (0.63µm) |
Copper Alloy |
Polyester |
-55°C ~ 125°C |
|
 |
8130 In Stock |
7.61310 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
50 (2 x 25) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
171 In Stock |
13.80000 |
Active |
Transistor |
3 (Rectangular) |
- |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Board Guide, Flange |
Solder |
- |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-55°C ~ 175°C |
|
 |
3605 In Stock |
1.68540 |
Active |
Zig-Zag, Right Stackable |
24 (2 x 12) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
8488 In Stock |
0.81700 |
Active |
PLCC |
20 (4 x 5) |
0.050" (1.27mm) |
Tin |
160.0µin (4.06µm) |
Copper Alloy |
Surface Mount |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
160.0µin (4.06µm) |
Copper Alloy |
Polybutylene Terephthalate (PBT), Glass Filled |
-40°C ~ 105°C |
|
 |
165 In Stock |
29.22000 |
Active |
LGA 4189 |
2092 |
0.039" (1.00mm) |
Gold |
30.0µin (0.76µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.034" (0.86mm) |
Gold |
30.0µin (0.76µm) |
Copper Alloy |
Thermoplastic |
-25°C ~ 100°C |
|
 |
1 In Stock |
5.48000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Gold |
Flash |
Copper |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 105°C |
|
 |
9450 In Stock |
0.20040 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
6 (2 x 3) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
2401 In Stock |
0.20040 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
6 (2 x 3) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
6807 In Stock |
1.17050 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
84 In Stock |
53.86000 |
Obsolete |
PGA, ZIF (ZIP) |
121 (11 x 11) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
- |
Solder |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Polyethersulfone (PES) |
-55°C ~ 150°C |
|
 |
3619 In Stock |
15.90140 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
52 (2 x 26) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
22 In Stock |
3.32000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
7204 In Stock |
13.60590 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
3963 In Stock |
7.02160 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
56 (2 x 28) |
0.070" (1.78mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.070" (1.78mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
2237 In Stock |
3.95170 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
50 In Stock |
8.19000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
8 (2 x 4) |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Phosphor Bronze |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Phosphor Bronze |
Polyamide (PA46), Nylon 4/6 |
- |
|
 |
2193 In Stock |
3.37000 |
Obsolete |
DIP, 0.3" (7.62mm) Row Spacing |
14 (2 x 7) |
0.100" (2.54mm) |
Gold |
25.0µin (0.63µm) |
Copper Alloy |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
- |
- |
- |
Polyester |
-55°C ~ 105°C |
|
 |
1108 In Stock |
1.66000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Tin |
100.0µin (2.54µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
3500 In Stock |
2.16820 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
1062 In Stock |
2.83570 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
42 (2 x 21) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
