Sockets for ICs, Transistors
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Mfr Part #
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Quantity Available
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Price
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Product Status
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Type
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Number of Positions or Pins (Grid)
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Pitch - Mating
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Contact Finish - Mating
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Contact Finish Thickness - Mating
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Contact Material - Mating
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Mounting Type
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Features
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Termination
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Pitch - Post
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Contact Finish - Post
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Contact Finish Thickness - Post
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Contact Material - Post
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Housing Material
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Operating Temperature
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21 In Stock |
65.76000 |
Active |
LGA |
3647 |
0.039" (1.00mm) |
Gold |
30.0µin (0.76µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.034" (0.86mm) |
Gold |
30.0µin (0.76µm) |
Copper Alloy |
Thermoplastic |
- |
|
 |
1052 In Stock |
1.84000 |
Active |
PLCC |
32 (2 x 7, 2 x 9) |
0.050" (1.27mm) |
Tin |
160.0µin (4.06µm) |
Copper Alloy |
Surface Mount |
Closed Frame |
Solder |
0.050" (1.27mm) |
Tin |
160.0µin (4.06µm) |
Copper Alloy |
Polybutylene Terephthalate (PBT), Glass Filled |
-40°C ~ 105°C |
|
 |
2758 In Stock |
3.98000 |
Active |
SIP |
20 (1 x 20) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
- |
Press-Fit |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
83 In Stock |
3.18000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Liquid Crystal Polymer (LCP) |
-55°C ~ 125°C |
|
 |
8971 In Stock |
1.95300 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
7193 In Stock |
1.44000 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-40°C ~ 105°C |
|
 |
33 In Stock |
29.22000 |
Active |
LGA 4189 |
2092 |
0.039" (1.00mm) |
Gold |
15.0µin (0.38µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.034" (0.86mm) |
Gold |
15.0µin (0.38µm) |
Copper Alloy |
Thermoplastic |
-25°C ~ 100°C |
|
 |
198 In Stock |
10.26000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
68 (2 x 34) |
0.070" (1.78mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.070" (1.78mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
82 In Stock |
122.61000 |
Active |
PGA, ZIF (ZIP) |
- |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Beryllium Copper |
Polyphenylene Sulfide (PPS) |
-65°C ~ 125°C |
|
 |
4306 In Stock |
1.37250 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
8380 In Stock |
0.93680 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
18 (2 x 9) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Surface Mount |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
1652 In Stock |
1.63000 |
Obsolete |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Closed Frame |
Solder |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Thermoplastic, Glass Filled |
-55°C ~ 125°C |
|
 |
441 In Stock |
11.04000 |
Active |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
- |
|
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41 In Stock |
11.29000 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
40 (2 x 20) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame, Decoupling Capacitor |
Solder |
0.100" (2.54mm) |
Tin |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
9613 In Stock |
6.03720 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
12 (2 x 6) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole, Right Angle, Horizontal |
Closed Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
2615 In Stock |
0.80090 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
9769 In Stock |
0.97300 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
10 (2 x 5) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
9088 In Stock |
4.05640 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
28 (2 x 14) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
4718 In Stock |
1.91280 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
Flash |
Beryllium Copper |
Through Hole |
Elevated, Open Frame |
Solder |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
4235 In Stock |
1.57090 |
Active |
DIP, 0.3" (7.62mm) Row Spacing |
16 (2 x 8) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
167 In Stock |
65.72000 |
Active |
LGA |
3647 |
0.039" (1.00mm) |
Gold |
30.0µin (0.76µm) |
Copper Alloy |
Surface Mount |
Open Frame |
Solder |
0.034" (0.86mm) |
Gold |
30.0µin (0.76µm) |
Copper Alloy |
Thermoplastic |
- |
|
 |
7951 In Stock |
5.56310 |
Active |
DIP, 0.6" (15.24mm) Row Spacing |
50 (2 x 25) |
0.100" (2.54mm) |
Gold |
29.5µin (0.75µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Wire Wrap |
0.100" (2.54mm) |
Tin |
- |
Brass |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
-55°C ~ 125°C |
|
 |
6857 In Stock |
12.90150 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
32 (2 x 16) |
0.100" (2.54mm) |
Gold |
10.0µin (0.25µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
|
 |
366 In Stock |
2.26000 |
Active |
DIP, 0.4" (10.16mm) Row Spacing |
22 (2 x 11) |
0.100" (2.54mm) |
Gold |
30.0µin (0.76µm) |
Beryllium Copper |
Through Hole |
Open Frame |
Solder |
0.100" (2.54mm) |
Tin-Lead |
200.0µin (5.08µm) |
Brass Alloy |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
-55°C ~ 125°C |
